Move over, Frore, there's a new player in town. A research team comprising boffins from the Danish Technological Institute and the Heatflow company have come up with a 3D-printed cooler that can draw a whopping 600 W off a chip fully passively, without any pumps or fans, 3D Printing Industry reports. The design is naturally aimed at datacenters first and foremost, though one can imagine a world where variations on the design could work on desktop PCs and workstations.
Should the presented figures pan out, to say this cooler is impressive is quite the understatement. The original specification set an already-ambitious target of 400 W, a figure that was exceeded by a nice, round 50%.
The cooler's dissipation ability is impressive enough, but the liquid that goes out of it is claimed to be at 60 to 80°C, making it easy to recover and use in other heating networks for a double-whammy. The report claims these figures are superior to standard datacenter cooling that whisks away heat at lower temperatures, making it harder to reuse.
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