3D-printed fan-less and pump-less liquid cooler can deliver 600 watts of cooling for data centers — passive design provides reusable heat, exceeds project performance expectations by 50%

5 hours ago 8
Danish Institute passive datacenter cooler
(Image credit: Danish Technological Institute)

Move over, Frore, there's a new player in town. A research team comprising boffins from the Danish Technological Institute and the Heatflow company have come up with a 3D-printed cooler that can draw a whopping 600 W off a chip fully passively, without any pumps or fans, 3D Printing Industry reports. The design is naturally aimed at datacenters first and foremost, though one can imagine a world where variations on the design could work on desktop PCs and workstations.

Should the presented figures pan out, to say this cooler is impressive is quite the understatement. The original specification set an already-ambitious target of 400 W, a figure that was exceeded by a nice, round 50%.

The cooler's dissipation ability is impressive enough, but the liquid that goes out of it is claimed to be at 60 to 80°C, making it easy to recover and use in other heating networks for a double-whammy. The report claims these figures are superior to standard datacenter cooling that whisks away heat at lower temperatures, making it harder to reuse.

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Bruno Ferreira is a contributing writer for Tom's Hardware. He has decades of experience with PC hardware and assorted sundries, alongside a career as a developer. He's obsessed with detail and has a tendency to ramble on the topics he loves. When not doing that, he's usually playing games, or at live music shows and festivals.

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